PCB Layout Engineer — High-Speed Embedded Hardware

About the Role

As a PCB Layout Engineer at Naveera, you will own the PCB layout execution for our custom AI/IoT edge hardware platform. You will work from approved schematics and design constraints to drive placement, stackup planning, high-speed routing, power/ground strategy, manufacturing outputs, and layout release readiness.

This role is focused on PCB layout, not schematic ownership. The ideal candidate has strong experience laying out dense, high-speed embedded boards with application processors, memory, camera interfaces, power supplies, wireless modules, and automotive-style I/O.

Responsibilities

• Own PCB layout from early component placement through routing completion, design review, fabrication release, and assembly handoff
• Work from schematics, datasheets, hardware design guides, and layout constraint documents
• Plan and implement PCB stackup, layer usage, impedance targets, via strategy, spacing rules, and length-matching constraints
• Perform dense BGA fanout for SoCs, PMICs, LPDDR, eMMC/UFS, wireless modules, and high-speed connectors
• Route high-speed interfaces including LPDDR, eMMC/UFS, MIPI CSI, USB, PCIe/SATA, SDIO, clocks, and related differential pairs
• Execute DDR/LPDDR layout with controlled impedance, length matching, skew control, reference-plane continuity, and clean return paths
• Place and route PMICs, DC/DC converters, LDOs, load switches, power-good signals, reset circuits, and decoupling networks
• Optimize power and ground planes for low impedance, clean return paths, decoupling effectiveness, EMI control, and manufacturability
• Layout camera, wireless, audio, CAN, UART, I2C, SPI, boot, debug, and test-point circuits
• Identify layout risks before fabrication and document clear action items for resolution
• Support layout reviews with electrical, firmware, mechanical, sourcing, PCB fabrication, and assembly partners
• Drive DFM, DFT, EMI/ESD, thermal, and manufacturing-readiness checks before release
• Prepare and review manufacturing outputs including Gerbers, ODB++, drill files, fabrication notes, assembly files, pick-and-place files, and release packages
• Support board bring-up and hardware debug by reviewing layout-related issues, rework paths, and root-cause findings
• Maintain clean layout documentation, constraint notes, review comments, and release records

Required Qualifications

• 7+ years of professional PCB layout experience for complex embedded, digital, or high-speed systems
• Strong experience with 8+ layer multilayer PCB layout
• Experience laying out application processors, SoCs, MPUs, FPGAs, or other dense BGA-based platforms
• Strong understanding of PCB stackup planning, impedance control, power/ground plane strategy, return paths, and layer-count tradeoffs
• Experience routing DDR/LPDDR, high-speed differential pairs, controlled-impedance traces, length-matched buses, and skew-sensitive interfaces
• Experience with dense BGA fanout, via-in-pad, HDI, microvias, fine-pitch components, and high-density placement
• Strong understanding of decoupling placement, PDN layout, PMIC layout, switching regulator layout, and board-level power integrity
• Ability to read schematics and understand circuit intent well enough to make correct placement and routing decisions
• Experience preparing manufacturing outputs including Gerbers, ODB++, fabrication notes, assembly files, BoM support files, and design release packages
• Experience with Altium Designer, Cadence Allegro, OrCAD PCB Designer, or similar professional PCB layout tools
• Ability to communicate layout risks clearly and work with remote engineers or external partners to close issues

Preferred Qualifications

• 10+ years of PCB layout experience for complex embedded hardware or high-speed digital systems
• Experience with Rockchip, NXP, Qualcomm, Renesas, TI, NVIDIA Jetson, or similar embedded processor platforms
• Experience with LPDDR4/LPDDR4X/LPDDR5 layout
• Experience with MIPI CSI camera systems, image sensors, USB-C, PCIe, SATA, SDIO, wireless modules, CAN, and audio codecs
• Experience with SI/PI review tools such as HyperLynx, Ansys, Sigrity, Polar, or similar
• Experience taking boards from prototype layout through EVT, DVT, PVT, or production release
• Experience working directly with PCB fabricators and assembly houses to resolve DFM, yield, stackup, via, and fabrication issues
• Experience with automotive, IoT, edge AI, robotics, surveillance, camera systems, or embedded Linux hardware
• Comfortable reviewing layout against processor hardware design guides, reference designs, and manufacturer routing constraints

Experience

• PCB layout: 7 years required
• High-speed multilayer PCB layout: 5 years preferred
• 8+ layer PCB layout: required
• Dense BGA / HDI layout: preferred
• DDR or LPDDR layout: preferred